Per Larsson-Edefors Implementation of FEC for high-throughput optical communication

All workshops

  • - will be organized in a 100% virtual way
  • - on Sunday, 6 December 2020
  • - from 13:30 - 17:00 (Brussels time)
  • - with live or pre-recorded presentations (to be confirmed)
  • - with live Q&A and discussion sessions
  • - and open to all conference registrants.

List of scheduled Sunday workshops:

  • WS 1: Ultra-wideband systems: next frontier of research
  • WS 2: The technologies for next-generation ultra-high-density cables - New cable structure, new fibers and new relating technologies
  • WS 3: If, how, and where is artificial intelligence (AI) beneficial in optical networks and interconnects?
  • WS 4: Co-Packaging of Photonics & Electronics
  • WS 5: Photonics-Electronics Integration: Opportunities and Challenges for Signal Processing
  • WS 6: Pathway to Bring Photonics in High-Performance Computing: from Materials to Applications
  • WS 7: EPIXfab workshop - Fabless start-ups developing PIC-based products: opportunities and challenges​
  • WS 8: proposal withdrawn
  • WS 9: Constellation shaping – All set for maximizing capacity?
  • WS 10: Advances towards Millimeter- and Terahertz-wave antenna arrays for broadband wireless
  • WS 11: Coherent optics for Intra-Data Center/Campus Optical Interconnects
  • WS 12: Is the time ripe for ultra-high bandwidth photonics in data centers?
  • WS 13: Post 5G edge cloud computing: why, what and when?
  • WS 14: The next generation of fixed networks by ETSI F5G

 

More detailed & updated information on Sunday workshops:

 

WS 1: Ultra-wideband systems: next frontier of research

Organisers: Uiara Celine de Moura (DTU Fotonik, Denmark) and Maria Ionescu (Nokia-Bell labs)

Abstract: Ultra-wideband (UWB) systems are emerging as a viable solution to cope with the exploding capacity demands in optical networks. These systems leverage the already deployed single mode fibers by extending the transmission over the low-loss optical spectrum beyond the conventional band. This approach could potentially be a more readily available and cost-effective solution to increasing capacity, when compared to space division multiplexing (SDM) approaches. UWB systems could additionally enable a pay-as-you-grow strategy, allowing operators to add more bands as needed. However, the deployment of UWB systems also comes with a set of challenges, such as the availability of optical components, physical integration, system management, optical power optimization, bandwidth allocation, and electrical power consumption. The aim of this workshop is to present ongoing research addressing some of these design challenges and foresee future developments in UWB systems.

Programme:

  • 13:30 - 13:35: Welcome and introduction to the workshop
    13:35 - 14:00: Takayuki Kobayashi (NTT, Japan): “Ultra-wide band WDM transmission by using optical parametric amplifiers”
    14:00 - 14:25: Antonio Napoli (Infinera, Germany): “Challenges and potentialities of wideband optical networks”
    14:25 - 14:50: Jin-Xing Cai (Subcom, USA): “Challenges in the adoption of ultra-wideband in submarine optical transmission systems”
    14:50 - 15:15: Muhammad S Sarwar (Fujitsu, USA): “Ultra-high capacity WDM multiband transmission systems, using C band transponders”
    15:15 - 15:45: Coffee break
    15:45 - 16:10: Ann Margareth Rosa Brusin (Politecnico de Torino, Italy): “Design and analysis of ultra-wideband Raman amplifier considering full and partial loads”
    16:10 - 16:35: Aymeric Arnould (Nokia Bell Labs, France): “Ultra-wide band optical transmission systems using semiconductor optical amplifiers”
    16:35 - 17:00: Wladek Forysiak (Aston Univ., UK): “Recent advances in Raman amplifiers for ultra-wideband transmission systems”

 

WS 2: The technologies for next-generation ultra-high-density cables - New cable structure, new fibers and new relating technologies

Organisers: Kazuhide Nakajima (NTT, Japan), Adrian Amezcua (Prysmian Group, France) and Durgesh Vaidya (OFS, USA)

Abstract: Space division multiplexing (SDM) is recognized as a key technology to overcome the future capacity crunch. The fibre count in an optical cable has been rapidly increasing in these years. Optical submarine network operators have already considered 12 optical fibre pairs in their next systems, and further more fibre pairs are expected to be implemented in future systems. In a terrestrial network, thinner coating and/or rollable optical fibre ribbon enable us to realize a high-density optical fibre cable, and an optical cable which contains 1,000 to 6,912 optical fibres is expected be beneficial for inter DC application. To accommodate more than 10,000 optical fibres in single small-diameter optical cable or to realize higher density cable, this workshop discusses what kind of cable structure, what kind of fiber, and what kind of relating technologies would be required.

List of confirmed speakers:

Session 1: Advances in high-density cables and new fibres (12 minutes (incl. Q&A) per person)

  1. T. Goddard (OFS, USA): On scaling application-specific core density in optical cables
  2. S. Grubb (Facebook, USA): Perspective and requirement for optical fibre cable for DC network
  3. A. Bertaina (Prysmian, France): Extreme fiber count cable systems for data center interconnects
  4. S.R. Bickham (Corning, USA): Reduced clad optical fibres compatible with ITU-T standards
  5. K. Benyahya (Nokia Bell Labs, France): Mode Group Division Multiplexing for short reach transmission systems
  6. K. Mukasa (Furukawa, Japan): Multi-core fibre technologies and their applicability to high-fibre count cable

Session 2: Key technologies and standardization for next generation optical cable

(12 minutes (incl. Q&A) per person)

  1. W. Zheng (AFL, USA): Automated alignment and splicing for multi-core fibers
  2. E. Lopez (CREOL, USA): Low loss multicore fiber spliceable FIFO
  3. E. Fallahmohammadi (Prysmian, USA): Efficient splicing techniques of flexible optical fibre ribbon Ribbon connection
  4. C. Antonelli (Univ. of L’Aquila, Italy): Deployed-SDM-fiber testbed
  5. Y. Yamada (NTT, Japan): Spatial mode control in an optical fibre cable
  6. P. Pondillo (Corning, USA): Standardization of optical fibre cable and components for SDM technology

 

WS 3: If, how, and where is artificial intelligence (AI) beneficial in optical networks and interconnects?

Organisers: Lena Wosinska (Chalmers Univ. of Technology), Francesca Parmigiani (Microsoft), and Chongjin Xie (Alibaba)

Abstract: In the recent years AI technologies have been proposed and claimed to be instrumental across a variety of industrial sectors, including optical networks. Their applications in both optical networks and data center interconnects have been widely investigated in all the various layers (physical, network and service), for example, to increase fiber link capacity, reduce operational cost, optimize resource usage, and support new services. In this workshop we will discuss the real needs and performance advantages as well as the associated challenges of AI-driven solutions for a number of use cases in both optical networks and data center interconnects.

The workshop will address the following topics:

  • New trends in optical networks control and automations: in what extent and at what pace will AI be introduced in network operation? What are the benefits and what are the challenges?
  • Where should AI be used, data plane, control plane or both?
  • What are the advantages of using AI in optical networks and interconnects over conventional techniques based on modelling and theory?
  • How to use AI in performance monitoring and how it can improve the optical network agility?
  • Can AI improve the optical networks efficiency in terms of resource utilization, energy consumption and reliability performance?

The workshop will be divided in two parts. The first part will consist of short presentations (15 min incl. QoA) given by the experts on the topics targeted by the workshop. The second part will be an interactive panel discussion involving both the experts and the audience.

List of confirmed speakers:

  1. Darko Zibar (DTU, Denmark): Toward intelligence in photonic systems
  2. Rui M. Morais (Infinera, Portugal): Suitability, Requisites, and Challenges of Machine Learning in Multilayer Optical Networks
  3. Achim Autenrieth (ADVA, Germany): New trends in network control and automation, the system provider perspective
  4. Victor Lopez (Telefonica, Spain): New trends in optical network control and automation: the network operator perspective
  5. Paolo Monti (Chalmers University of Technology, Sweden): AI-based service orchestration: challenges and opportunities
  6. Qunbi Zhuge (Shanghai Jiaotong University, China): A telemetry layer with data fusion and onlin learning
  7. Dan Kilper (University of Arizona, USA): Intelligent optical systems for 5G and beyond
  8. Maria Ionescu (Nokia Bell Lab, France): Addressing Challenges in Optical Systems Design through Artificial Intelligence
  9. Zahra Bakhtiari (Microsoft, USA): Applications of machine-learning in optical networking at cloud scale
  10. Lei Wang (Alibaba, China): Learning from data for operation of datacenter optical networks
  11. Maxim Kuschnerov (Huawei, Germany): Deep Learning as the next frontier in DSP design for coherent optical networks
  12. Massimo Tornatore (Politecnico di Milano, Italy): Learning with Limited Data for QoT estimation and Failure Management in Optical Networks

 

WS 4: Co-Packaging of Photonics & Electronics

Organisers: Peter O’Bien (Tyndall Institute), and Thomas Liljeberg (Intel)

Abstract:

There is a growing trend to integrate more functionality into photonic packages. This trend is driven by requirements to improve system performance, such as increasing system operating speed and reducing power consumption. There is also a demand to reduce system size to facilitate the demand for compact sensor networks in rapidly expanding markets such as IoT and 5G. Co-packaging of photonic and electronic devices provides a route to meet these requirements. Co-packaging can take the form of 2D or 3D integration, where devices are packaged side-by-side or stacked vertically, respectively. However, challenges remain in areas such as optical interconnect for low-loss coupling and compact interposers for high-density and high-frequency electrical connections. Furthermore, as photonic devices move towards higher levels of complexity through increased on-chip functionality, thermal management becomes a critical factor which impacts on system performance and reliability. The workshop will review the latest developments in co-packaging of photonics and electronics and emerging market trends. Speakers will discuss application requirements, state-of-the-art technological approaches to co-packaging and the challenges to realise cost-effective and scalable manufacturing for co-packaged modules.

  • For each session:
  • - 75 Mins (5 Speakers, 15 mins each including Q&A)
  • - Panel Discussion
  • - Prepare questions in advance of workshop (to be shown on screen & answered during panel session)

Session 1: Co-Packaging Applications:

  1. Keren Bergman (Columbia University, USA): Embedded photonics for deeply disaggregated computing application
  2. Daniel Kuchta (IBM, USA): Low cost VCSEL-based co-packaging solutions for HPC and Data Centers
  3. Mark Filer (Microsoft, USA): Motivators and Requirements for CPO at Microsoft
  4. Anthony Torza (Cisco, USA): OEM Perspectives on Co-Packaged Optics
  5. Jeff Hutchins (OIF, USA): Standardization needs and options for next generation Co-packaging of Photonics and Electronics

Break (30 mins)

Session 2: Co-Packaging Technologies:

  1. Twan Korthorst (Synopsys, The Netherlands): Design Automation for Integrated Photonics Technologies
  2. Vikas Gupta (Global Foundries, USA): Silicon Photonic Wafer Foundry Processes and Commercialisation
  3. Ignazio Piacentini (ficonTEC, Germany): Automated Test Systems for Integration Photonic Technologies
  4. Sven Otto (Sicoya, Germany): Development and Manufacturing of an Integrated Photonic Transceiver Product
  5. Jihan Chen (ASE Group, Taiwan): Packaging Development for Co-packaged Optics

 

WS 5: Photonics-Electronics Integration: Opportunities and Challenges for Signal Processing

Organisers: Xi Chen (Nokia Bell-labs), Stephan Pachnicke (Kiel Univ.) & Christoph Scheytt (Paderborn Univ.)

Abstract: Today optical and electronic circuits are still clearly separated domains. In the recent past, however, photonic-electronic integration is developing rapidly based on either Silicon photonics or Indium-Phosphide technology platforms. This enables close proximity between optics and electronics and consequently higher bandwidths, reduced energy consumption and size. The close integration also opens up new approaches to signal processing both in the analog and digital domains.

This workshop will investigate how photonic-electronic integration can pave the way to completely new system concepts. It will discuss examples of future signal processing circuits and elaborate challenges and limitations.

List of confirmed speakers:

  1. Stefan Meister (Sicoya, Germany): Silicon Electronic-Photonic Integrated Circuits for Data Center Application
  2. Nebosja Stojanovic (Huawei, Germany): Signal Processing in Future Data Centers with Photonics-Electronics Integrated Circuits
  3. Cederic Lam (Google, USA): Future transceivers for intra-data center communications
  4. Tim Koene (Effect Photonics, The Netherlands): System-on-Chip Transceivers for High-Capacity Metro Networks
  5. Robert Maher (Infinera, USA): Future coherent transponders that incorporate hardware/signal processing co-design
  6. Mark Filer (Microsoft, USA): Impact of Co-Packaging for Future Cloud Scale Data Centers
  7. Bert Offrein (IBM, Switzerland): Opportunities for analog signal processing in the electrical and the optical domain
  8. Christian Koos (KIT, Germany): Photonic-electronic approaches to ultra-wideband signal processing
  9. Jeremy Witzens (RWTH Aachen, Germany): Silicon photonics NLFT transmitter with optical soliton merging
  10. Kambiz Jamshidi (TU Dresden, Germany): Photonic Integrated Circuits for Reservoir Computing

 

WS 6: Pathway to Bring Photonics in High-Performance Computing: from Materials to Applications

Organisers: Francesca Parmigiani (Microsoft), Bhavin Shastri (Queens University), Paul. R. Prucnal (Princeton University).

Abstract: In the recent years, microelectronic computers have encountered challenges in meeting all of today’s demands for new applications in high-performance computing. Neural network models have come to dominate modern machine learning algorithms, and combinatorial optimization problems solvers are extremely important in multiple sectors, such as drug discovery and finance.

Continuing meeting these demands, as the size of the network or problem scales, will require the development of unconventional computers employing alternative processing models and new device physics. Dedicated pieces of electronic hardware have been developed to speed up specific operations and implement them more efficiently. 

Photonic integration industry promises to bring manufacturing ecosystems normally reserved for microelectronics to photonics. Photonic devices have already found simple analog signal processing niches where electronics cannot provide sufficient bandwidth and reconfigurability. In order to solve more complex information processing problems, they will have to adopt a processing model that generalizes and scales. Photonic neural networks aim to map physical models of optoelectronic systems to abstract models of neural networks. Similar discussion applies to coherent Ising machines. These field represent new opportunities for extremely-fast and energy-efficient machine information processing, with application to mathematical programming, intelligent radio frequency signal processing, and real-time control.

Ranging from materials, devices, systems, architectures, algorithms, and applications, this workshop will cover topics on the current status of the field of high-performance optical computing, including photonic neural networks, coherent Ising machines and emerging approaches such as quantum optical neural networks and superconducting optoelectronic networks. Future challenges and advances in science and technology to meet challenges will also be discussed. Finally, the workshop will aim to address the challenges associated with commercializing this technology driven by applications domains.

The workshop will be divided in two parts. The first part will consist of short presentations (10 min plus few minutes QoA) given by the experts on the topics targeted by the workshop. The second part will be an interactive panel discussion involving both the experts and the audience.

List of confirmed speakers:

  1. Demetri Psaltis (EPFL, Switzerland): Past, present and future of neuromorphic photonics
  2. Ingo Fischer (IFISC, Spain): Photonic Reservoir Computing for Optical Communication Systems
  3. Shanhui Fan (Stanford University): Recurrent neural network based on wave physics
  4. Harish Bhaskaran (University of Oxford, UK): Functional materials enable superior tensor cores to backpropagation free photonic computing hardware
  5. Daniel Brunner (CNRS, France): Achieving scalable photonic interconnects witch 3D fabrication
  6. Alexander Tait (NIST, USA): Neuromorphic silicon photonics on emerging and contemporary foundry platforms
  7. Volker Sorger (George Washington University): Photonic tensor core and nonvolatile memory for machine intelligence
  8. Ryan Hamerly (MIT, USA): Scalable optical neural networks based on coherent detection
  9. Hiroki Takesue (NTT, Japan): Coherent Ising machine based on degenerate optical parameteric oscillators
  10. Fabian Bohm (Vrije Universiteit Brussel, Belgium): Coherent Ising machine based on opto-electronic oscillators
  11. Claudio Conti (Universita di Roma, Italy): Large-scale photonic Ising machine by spatial light modulation
  12. Sylvain Gigan (LightON, France): Computing with disorder: classical and quantum computing

 

WS 7: EPIXfab workshop - Fabless start-ups developing PIC-based products: opportunities and challenges

Organisers: Roel Baets (Ghent University – imec)

Abstract: Photonic Integrated Circuits (PICs) have stamped their presence in the optical transceiver market through the launch of various transceiver products by key players of that market. In the last few years, many fabless startups are leading an equally impressive entry of PICs into new markets to offer solutions for sensing, medical diagnostics, LiDAR, 5G, artificial intelligence, and many other applications. PIC technologies and associated services are gaining maturity at an unprecedented pace. This rapidly consolidating ecosystem can fulfill the demands of fabless companies operating in new markets. 
This workshop aims to:
•present how various startups develop innovative products in various new markets based on PICs
•address outstanding challenges faced by fabless companies with respect to the capabilities of the PIC ecosystem

List of confirmed speakers:

  1. Andrew Rickman (Rockley Photonics, USA): Fabless startups developing PIC-based products: opportunities and challenges
  2. Mark Wade (Ayar Labs, USA)
  3. Thijs Spuessens (Sentea, Belgium)
  4. Zhan Su (Lightelligence, USA)
  5. Sven Otte (Sicoya, Germany)
  6. Steven Miller (Voyant Photonics, USA)
  7. Shuren Hu (SiLC, USA)
  8. Panel Discussion

 

WS 8: Proposal withdrawn

 

WS 9: Constellation shaping – All set for maximizing capacity?

Organisers: Alex Alvarado (TU/e) and Tobias Fehenberger (ADVA)

Abstract: Geometrical constellation shaping (GCS) and probabilistic constellation shaping (PCS) promise to squeeze the last tenths of a dB out of high-capacity optical fiber links. However, the optical fiber community seems to have different opinions about the future of signal shaping. One camp believes that it is end of the road for GCS and PCS in the sense that only the engineering problem of implementing and productizing well-understood methods is left. The second camp argues that more work needs to be done to fully understand the trade-offs associated with the available techniques, as well as to find ways to unlock the maximum shaping gain of the nonlinear fiber channel.

In this workshop, speakers from academy and industry from both camps will share their views on the future of constellation shaping and the prospects of maximizing capacity by addressing the following questions: Will signal shaping just be an off-the-shelf—possibly even standardized—part of our DSP toolbox? What else can we improve on the DSP side (including FEC, implementation penalties, adaptability) and is it worth doing so in the system context (considering latency, complexity, cost, power consumption)? Is the rate adaptivity offered by PCS a killing argument to completely forget about GCS? How much rate adaptivity do we actually need in optical networks? And why not achieving this via rate-adaptive FEC or time-hybrid modulation formats? On top of constellation shaping, what tools could make it into our DSP toolbox to achieve even higher throughput?

List of confirmed speakers: 

  1. Robert Fischer (Ulm University, Germany): Shaping: Be Altruistic to the Receiver
  2. Bin Chen (Hefei University of Technology, China): Multidimensional geometric shaping for high-capacity nonlinearity-tolerant transmission
  3. Marco Secondini (Scuola Superiore Sant'Anna, Italy): Coding is dead. Shaping is dead. And I don't feel so well myself... Why are information theorists so hypochondriac?
  4. Metodi Yankov (DTU, Denmark): Probabilistic shaping for the optical phase conjugation channel
  5. Altug Sural (Bilkent University / Polaran, Turkey): Polar Codes for Tb/s Communications
  6. Junho Cho (Nokia Bell Labs, USA): Implementation aspects of probabilistic constellation shaping
  7. Mehdi Torbatian (Infinera, Canada): Essential Ingredients of Practical Probabilistic Constellation Shaping
  8. Olga Vassilieva (Fujitsu, USA): Probabilistic vs. geometric shaping in commercial applications

 

WS 10: Advances towards Millimeter- and Terahertz-wave antenna arrays for broadband wireless

Organisers: Guillermo Carpintero (Universidad Carlos III de Madrid) and Tadao Nagatsuma (Osaka University)

Abstract: Microwaves, Millimeter-wave and Terahertz frequency bands are being pursued for beyond 5G, enabling ultra-broadband wireless communications, to unlock 100 Gb/s data rates. Because these bands all together occupy but a tiny fraction of the spectrum of optical spectrum, photonics technologies can be used to efficiently propagate and manipulate these signals. Actually, photonic technologies have already demonstrated broadband photonic signal generation, up-conversion and down-conversion, as well as true-time-delay photonic beam-forming of antenna phased arrays. This workshop aims to present a broader view of the current state-of-the-art in crucial developments to enable photonic driven beam-forming and beam-steering  antenna phased arrays. This workshop covers integrated microwave photonics approaches, in which photonic integration technology is employed to overcome the energy-efficiency, flexibility and scalability, as well as performance limitations of the current systems using optical fiber and discrete-components. The program includes as well additional key technologies, such as novel antenna approaches and dielectric waveguide structures.

List of confirmed speakers:

  1. Kazutoshi Kato (Kyushu University, Japan): Beam forming and steering of terahertz wave by arrayed photomixers
  2. Daniel Headland (Osaka Univ., Japan): Integrated slab-mode beam launchers and their applications for terahertz waves
  3. Andreas Stöhr (University Duisburg-Essen, Germany): Photonic THz Interconnects
  4. David Gonzalez Ovejero (CNRS, IETR UMR 6164, France): Flat high-gain aperture antennas for mm-waves and sub-THz applications
  5. Muhsin Ali (UC3M, Spain): TERAWAY - Photonic Phased Array Antennas for mm-Wave and THz Beamsteering
  6. Jonathan Klamkin (UCSB, USA): Integrated Photonics for Millimeter Wave Communications and Phased Arrays

 

WS 11: Coherent optics for Intra-Data Center/Campus Optical Interconnects

Organisers: Ilya Lyubomirsky (Inphi) and Xiang Zhou (Google)

Abstract: Recent technology trends are showing significant challenges in scaling the IM-DD PAM architecture for 2-10km intra-campus data center interconnection applications.

Meanwhile, the success of 400G ZR has brought coherent pluggable module technology into the 10-100 km space, providing the lowest cost/power solution for >10km DCI applications.  We expect coherent optics to similarly disrupt intra-data center and intra-campus applications for reaches below 10km. However, intra-data center/campus networks are very different from telecom DWDM networks, and include a rich variety of short reach optical technologies, including VCSEL MMF for < 100m, parallel SMF systems for ~ 500m, and CWDM SMF systems for 2km “FR4” and 10km “LR4” applications.

This workshop will focus on the intersection of coherent technology with next generation 800G and 1.6T optical interconnects for 2km and 10km applications. The following questions will be addressed:

  1. How does coherent optics compare with IM-DD PAM and in which applications would coherent technology have the advantage?
  2. What innovations in optics are necessary to achieve the lowest cost?
  3. What is the optimum QAM modulation format? Is it different for 800G vs. 1.6T?
  4. What innovations in DSP algorithms are necessary to drive down power consumption?
  5. What is the right FEC to provide sufficient NCG for coherent systems while keeping latency < few hundred ns?
  6. How to address the backward compatibility challenge facing coherent optics ?

List of confirmed speakers:

  1. Ilya Lyubomirsky (Inphi) and Xiang Zhou (Google): Introduction
  2. Maxim Kuschnerov (Huawei, Germany): Technology drivers and network evolution enabling coherent optics in data center networks
  3. Radha Nagarajan and Kishore Kota (Inphi, USA): Coherent Pluggable Technology for Data Center Interconnects
  4. Chris Doerr (Doerr Consulting, USA): Where can coherent keep making inroads into IM-DD territory?
  5. Liming Wang (Google, USA): Coherent Optics for Datacenters --Where's the Beef?
  6. Keita Mochizuki (Mitsubishi Electric, Japan): Laser Devices and Modules for DCI Systems based on Coherent Technology
  7. Fotini Karinou (MSFT Research, UK): Future datacenter infrastructure: Challenges and opportunities
  8. Per Larsson-Edefors (Chalmers University, Sweden): Implementation of FEC for high-throughput optical communication
  9. David Plant (McGill Univ., Canada): Coherent and IM/DD Optical Interconnects for Short Reach
  10. Panel discussion

 

WS 12: Is the time ripe for ultra-high bandwidth photonics in data centers?

Organisers: Ioannis Tomkos (Univ. of Patras) and Yvan Pointurier (Nokia Bell-labs)

Abstract: As many stakeholders predict the end Moore's law for electronic switching in data centers, and server interface and switching port capacity keep increasing, optics is increasingly leveraged and stressed. Of course optical components offer larger bandwidths than electronic components, but they are also limited by the underlying electronics - for instance drivers and analog/digital converters. Will optics suffer the same fate as electronics and inherently limit data center scale, or will they enable new paradigms in data centers?

Our mix of academic and industrial speakers will tackle this question, focusing on the key infrastructure aspects of data centers. The speakers will review the current limitations faced by current data centers and architectures, and will discuss whether co-packaged optics is the way forward to circumvent Moore's law or just a fad. On the transmission side, they will introduce new components that could replace current pluggables to reach unseen short reach transmission capacity. Will optical (analog) signal processing, a hype in the 1990s before the disillusion of the 2000s, make a come-back in the 2020s to alleviate the pressure on electronic processing? Our speakers also have a good idea on that. And finally, the speakers will discuss the future of optical switching in data centers.

List of confirmed speakers:

  1. Paolo Costa (Microsoft, UK): Optics for the Cloud – Re-thinking Data-center Networking for a post-Moore’s Era
  2. Aaron Zilkie (Rockley Photonics, USA): High bandwidth Si Photonics and Co-Packaged Optics: Opportunities and Challenges
  3. Marco Fiorentino (HPE, USA): Silicon Photonics devices for low-latency all-to-all network
  4. Benedikt Baeuerle (Polariton, Switzerland): Plasmonics – Boosting Silicon Photonics to Terabit Modulation at the Micrometer Scale
  5. Jose Capmany (Universidad Politecnica de Valencia, Spain): Programmable Photonics
  6. Moshe Nazarathy (Technion, Israel): Ultra-fast energy-efficient optical digital to analogue conversion with direct binary drives
  7. Guangcan Mi (Huawei, Canada): Photonics in Datacenter: Towards an HPC networking solution
  8. Roberto Proietti (UC Davis, USA): Scalable Control & Data Plane Solutions for Optical Switching in the Cloud

 

WS 13: Post 5G edge cloud computing: why, what and when?

Organisers: Sébastien Bigo (Nokia Bell-labs) and Nicola Calabretta (TUE)

Abstract: Originally motivated by prospects of cost savings from virtualizing network functions of 5G networks, the distributed information technology (IT) infrastructure of edge-clouds comes with unique advantages, which will undoubtedly attract digital service providers into new business opportunities. One can easily predict that the largest potential for revenue creation will leverage its unmatched responsiveness. Overall, even if this new IT infrastructure is yet to be fully agreed upon, it will undoubtedly leverage highly-distributed IT resources, either ideally located in the 5G sites, or part of the thousands of new small data centers (DCs) being erected by cloud operators, as they move away from today’s dominant model of central cloud - where IT jobs are performed inside single location DCs. Regrettably, distributing IT over could steer the profitability of cloud businesses down because serves are more poorly utilized in average, unless machines become capable of efficiently cooperating across multiple locations. The workshop is meant to be a forum for major stakeholders to exchange on challenges and opportunities for this promising new paradigm of computing.

List of confirmed speakers:

  1. Dr. Luis Miguel Contreras Murillo (Telefonica, Spain) : “The role of service providers’ network for supporting edge computing in 5G and beyond
  2. Dr. Ignacio García-Carrillo (HPE, Belgium): “Enabling disaggregation at the telco edge”
  3. Alain Fiocco (OVH, France): “A Case for Cloud Provider in 5G edge deployments”
  4. Dr Lucia D’Acunto (TNO, The Netherlands): “Immersive XR experiences use cases and 5G edge clouds requirements”
  5. Prof. Florian Frick (Univ. of Stuttgart – ISW, Germany): “Converged Communication and Platforms as Key Technologies for Software Defined Manufacturing”
  6. Lieven Levrau (Nokia): “Deterministic service delivery impacts on the network infrastructures and edge clouds – an overview”
  7. Dr Julien Poirrier (Huawei, France): “Edge Computing is also about Fiber”
  8. Dr. Nikos Argyris (Nvidia, Greece): "Fronthaul and Edge Computing architectures enabled by Smart-NICs”
  9. Dr. Filippo Cugini, CNIT: "Enabling autonomous networking at the edge”

 

WS 14: The next generation of fixed networks by ETSI F5G

Organisers: Luca Pesando (ETSI), Philippe Chanclou (Orange Lab), and Xiang Liu (Futurewei)

Abstract: Fixed networks using optical fibre form an essential foundation of modern communications. From FTTH to core networks, data centres, and LANs, fibre is ubiquitous. Currently, there is an industry-wide effort to set a clear evolution path for fixed networks, similar to that seen in mobile networks with well-defined generations such as 3G, 4G, and 5G. The next generation of fixed networks is being regarded as F5G. The ongoing ETSI F5G initiative aims to bring such approaches to fixed fibre networks by defining clear generational capabilities and features as well as significant improvements from one generation to the next.

This workshop will bring together experts participating in this new F5G initiative, along with those deploying fibre networks and researchers considering how fibre networks might evolve. Many different use cases will be discussed, from conventional telecoms, to new applications such as in vertical industries and in premises networks. Topics in scope of this workshop will also include new technologies for FTTH and LAN, transport networks, network slicing, autonomous operation and end-to-end quality of experience (QoE).

The workshop will serve as a forum to discuss what F5G is about and to influence the future evolution of fixed optical fibre networks in different use cases. We expect a lively exchange of views as this is such a new and rapidly moving industry-wide initiative. It is hoped that new research activities will be stimulated by such discussions at ECOC that can help define future generations of fixed networks in the 5G era and beyond.

List of confirmed speakers:

  1. Luca Pesando (ETSI ISG F5G Chair): Opening Remark on the 5th Generation of Fixed Networks (F5G)
  2. Georgi Babinov (ETSI ISG F5G Vice Chair): F5G use cases and the support of verticals 
  3. Frank Effenberger (Futurewei Technologies): General overview of technology standards related to F5G
  4. Olivier Ferveur (POST Luxembourg): Operator application and use cases related to F5G
  5. Junjie Li (China Telecom): Recent advances in next-generation optical transport networks
  6. Marco Ruffini (Trinity College Dublin): Fibre access virtualisation technology and evolution paths to MEC support
  7. Panel Discussion and Q&A